Atomistic investigation of effect of twin boundary on machinability in diamond cutting of nanocrystalline 3C-SiC

Liang Zhao; Weimian Guan; Jiwen Xu; Zhiyuan Sun; Maoda Zhang; Junjie Zhang; Liang Zhao; Weimian Guan; Jiwen Xu; Zhiyuan Sun; Maoda Zhang; Junjie Zhang

doi:10.3934/matersci.2024056

AIMS Materials Science

2024, Volume 11, Issue 6: 1149-1164. doi: 10.3934/matersci.2024056

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Research article

Atomistic investigation of effect of twin boundary on machinability in diamond cutting of nanocrystalline 3C-SiC

1.
Shenyang Aircraft Industry (Group) Co., Ltd., Shenyang 110850, China
2.
Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China

Received: 30 September 2024 Revised: 05 December 2024 Accepted: 09 December 2024 Published: 12 December 2024

The machinability of hard brittle nanocrystalline cubic silicon carbide (3C-SiC) is strongly dependent on internal microstructure and its adapted machining response. Here, we conducted molecular dynamic simulations to explore the machinability of nanotwinned 3C-SiC with a large number of twin boundaries in diamond cutting. The effect of the introduction of twin boundaries on the diamond cutting of nanocrystalline 3C-SiC, particular for its contribution to suppressing brittle fracture and improving ductile-mode cutting, was investigated in-depth. Our simulation results revealed that twin boundaries exerted a significant impact on the deformation mechanism and subsequent surface integrity of nanocrystalline 3C-SiC. Specifically, intergranular fracture was significantly suppressed by the introduction of twin boundaries. In addition, various deformation behaviors such as phase transformation, crack propagation, dislocation activity, and twin boundary-associated deformation mechanisms were operated in cutting process of nanotwinned 3C-SiC. Furthermore, the influence of twin boundary spacing on the diamond cutting characteristics of nanotwinned 3C-SiC was also addressed.
- nanocrystalline 3C-SiC,
- ductile machinability,
- twin boundary,
- diamond cutting,
- molecular dynamics simulation
Citation: Liang Zhao, Weimian Guan, Jiwen Xu, Zhiyuan Sun, Maoda Zhang, Junjie Zhang. Atomistic investigation of effect of twin boundary on machinability in diamond cutting of nanocrystalline 3C-SiC[J]. AIMS Materials Science, 2024, 11(6): 1149-1164. doi: 10.3934/matersci.2024056

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Abstract

The machinability of hard brittle nanocrystalline cubic silicon carbide (3C-SiC) is strongly dependent on internal microstructure and its adapted machining response. Here, we conducted molecular dynamic simulations to explore the machinability of nanotwinned 3C-SiC with a large number of twin boundaries in diamond cutting. The effect of the introduction of twin boundaries on the diamond cutting of nanocrystalline 3C-SiC, particular for its contribution to suppressing brittle fracture and improving ductile-mode cutting, was investigated in-depth. Our simulation results revealed that twin boundaries exerted a significant impact on the deformation mechanism and subsequent surface integrity of nanocrystalline 3C-SiC. Specifically, intergranular fracture was significantly suppressed by the introduction of twin boundaries. In addition, various deformation behaviors such as phase transformation, crack propagation, dislocation activity, and twin boundary-associated deformation mechanisms were operated in cutting process of nanotwinned 3C-SiC. Furthermore, the influence of twin boundary spacing on the diamond cutting characteristics of nanotwinned 3C-SiC was also addressed.

References

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