Effects of milling time on the development of porosity in Cu by the reduction of CuO

Laura N. Guevara; Christopher B. Nelson; Gaurav Hans; Cammie L. Atwater; Mark A. Atwater; Laura N. Guevara; Christopher B. Nelson; Gaurav Hans; Cammie L. Atwater; Mark A. Atwater

doi:10.3934/matersci.2017.4.939

AIMS Materials Science

2017, Volume 4, Issue 4: 939-955. doi: 10.3934/matersci.2017.4.939

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Effects of milling time on the development of porosity in Cu by the reduction of CuO

1.
Department of Applied Engineering, Safety and Technology, Millersville University, Millersville, PA, USA
2.
Department of Health Science, University of Bridgeport, Bridgeport, CT, USA

Received: 29 July 2017 Accepted: 27 August 2017 Published: 29 August 2017

Microscale and nanoscale CuO was dispersed in Cu using room temperature high-energy ball milling over time intervals of 5, 30, 60, 120, and 240 min. These samples were then annealed under a reducing atmosphere for 1 h at temperatures of 400, 600, 800 and 1000 °C to create porosity by the reduction of the entrained oxides. Increases in porosity exceeding 40% were achieved using intermediate milling times and annealing temperatures. When considered cumulatively, the most effective processing conditions were a milling time of 30 min and expansion at 800 °C, but variations exist within each sample type. The complex relationship between milling time and annealing temperature is investigated in terms of particle size, morphology and microstructure. The findings indicate that room temperature milling is more efficient at producing porosity than comparable cryogenic methods, and this may enable industrial scaling of the process.
- microporous,
- metallic foam,
- intraparticle expansion,
- mechanical alloying,
- metal powder
Citation: Laura N. Guevara, Christopher B. Nelson, Gaurav Hans, Cammie L. Atwater, Mark A. Atwater. Effects of milling time on the development of porosity in Cu by the reduction of CuO[J]. AIMS Materials Science, 2017, 4(4): 939-955. doi: 10.3934/matersci.2017.4.939

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Abstract

Microscale and nanoscale CuO was dispersed in Cu using room temperature high-energy ball milling over time intervals of 5, 30, 60, 120, and 240 min. These samples were then annealed under a reducing atmosphere for 1 h at temperatures of 400, 600, 800 and 1000 °C to create porosity by the reduction of the entrained oxides. Increases in porosity exceeding 40% were achieved using intermediate milling times and annealing temperatures. When considered cumulatively, the most effective processing conditions were a milling time of 30 min and expansion at 800 °C, but variations exist within each sample type. The complex relationship between milling time and annealing temperature is investigated in terms of particle size, morphology and microstructure. The findings indicate that room temperature milling is more efficient at producing porosity than comparable cryogenic methods, and this may enable industrial scaling of the process.

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