Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

Roman Koleňák; Igor Kostolný; Roman Koleňák; Igor Kostolný

doi:10.3934/matersci.2018.5.889

AIMS Materials Science

2018, Volume 5, Issue 5: 889-901. doi: 10.3934/matersci.2018.5.889

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Research article

Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

Roman Koleňák ,
Igor Kostolný ^,

Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jána Bottu č. 2781/25, 917 24 Trnava, Slovak Republic

Received: 18 July 2018 Accepted: 22 August 2018 Published: 11 September 2018

The work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measure the solders melting intervals and their thermal properties, the DSC analysis was realized. The measurement of wettability was carried out in a controlled atmosphere by trigonometric method. Zn based solders wets none of the examined substrates. SnSb5 solder wets only Cu substrate with wetting angle of 54°. Soldering alloy BiAg11 wets all substrates, wherein the best result (23°) was achieved on Ag substrate. Shear strength of BiAg11 and SnSb5 joints reached higher value then classic PbSn5 solder.
- solder,
- substrate,
- thermal properties,
- wetting,
- protective atmosphere
Citation: Roman Koleňák, Igor Kostolný. Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures[J]. AIMS Materials Science, 2018, 5(5): 889-901. doi: 10.3934/matersci.2018.5.889

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Abstract

The work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measure the solders melting intervals and their thermal properties, the DSC analysis was realized. The measurement of wettability was carried out in a controlled atmosphere by trigonometric method. Zn based solders wets none of the examined substrates. SnSb5 solder wets only Cu substrate with wetting angle of 54°. Soldering alloy BiAg11 wets all substrates, wherein the best result (23°) was achieved on Ag substrate. Shear strength of BiAg11 and SnSb5 joints reached higher value then classic PbSn5 solder.

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